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Samsung 3nm GAA Inches Towards Productization With SRAM, SoC Test Vehicles
Samsung in collaboration with Synopsys recently announced they taped out the first high-performance and multi-subsystem system-on-chip on Samsung's upcoming 3-nanometer gate-all-around process...
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Photonics Chiplet Inches Towards Production
For nearly half a decade Ayar Labs has been working on introducing a step-function improvement in the I/O bandwidth of integrated circuits. The company has been working on making optical I/O...
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A Look At Qualcomm’s Data Center Inference Accelerator
About four years ago Qualcomm attempted to enter the data center market with its own Arm-based server CPUs with the launch of the Centriq 2400 server family based on their custom Falkor...
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Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC
A few years ago Intel announced its XPU effort which entails the diversification of their compute silicon through specialized architectures. More recently Intel formed a new Custom Compute Group...
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Reincarnating The 6502 Using Flexible TFT Tech For IoT
Despite being nearly 47 years old, the MOS Tech 6502 – or its low-power direct equivalents – is still being manufactured and is widely used in consumer products such as toys, automotive, and appliances...
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A Look At Intel 4 Process Technology
Back in early 2019, Intel finally publically acknowledged they screwed up – their ambitious 10-nanometer process was a bust; crazy density improvement goals along with too many novel technological...
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A Look At Samsung’s 4LPE Process
As Samsung readies its 3-nanometer process node which will introduce a new device architecture, we look at their last FinFET-based process technology - the 4-nanometer process. Though not...
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SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators
Last year SiFive introduced the Intelligence X280 processor, part of a new category of RISC-V processors for SiFive that aims at assisting AI and machine learning workloads. Launched under the new...
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IEDM 2022: Did We Just Witness The Death Of SRAM?
This year, the 68th Annual IEEE International Electron Devices Meeting (IEDM) was back in full force with nearly 1,500 engineers (in-person) from around the world making their yearly voyage back to...
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TSMC N3, And Challenges Ahead
In the relentless quest for smaller and more power-efficient transistors, the semiconductor industry has encountered amplified challenges, which recent cutting-edge process nodes have brought to the...
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